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Agenda

Preliminary agenda – subject to change. NAFEMS ASEAN Conference 2026, Friday 20 November 2026, Novotel Singapore On Stevens. Single track. Correct as of 10 September 2026.

NAFEMS ASEAN Conference 2026 - Preliminary Agenda.pdf

Friday 20 November 2026

08:30

Registration

Session 1 · 09:00 – 10:20
09:00

Welcome and Introduction

David Quinn, NAFEMS

09:20

Mechanistic Origin of Cohesive Bridge Formation in Starve-Fed Twin-Screw Extruder

Swan Htet, CSIRO

09:40

Practical Implementation and Use of Model Verification, Validation and Uncertainty Quantification (VVUQ) in Compliance

Majji Rao, UL India Pvt. Ltd.

10:00

AI-Augmented Shape Optimization of Monocopter Designs for Improved Aerodynamic Performance

Chian Yeen Fan, Singapore University of Technology and Design

10:20

Break

Session 2 · 10:50 – 12:10
10:50

Fast Optimization for Vehicle Exterior CFD Performance Using an AI Model

Arul Ganesan, Detroit Engineered Products

11:10

A CFD–Acoustic Workflow for Flow-Induced Audible Noise Prediction in a Throttle Control Valve

Akash Gupta, Oceaneering

11:30

Evaluating Machine Learning Models for Inverse CFD Problems

Fayiz Rahman, NING Research Pte Ltd

11:50

A CFD Study of Dynamic Air Flow Control on Clean Room Particle Concentration Response

Kah Xin Khoo, MyCAE Technologies Sdn Bdn

12:10

Photo, Lunch and Exhibition

Session 3 · 13:30 – 15:10
13:30

PANEL Panel Session: The Role of CAE in an AI World

Panellists to be confirmed

14:10

Design-Stage Defeaturing Cost Estimation in Nuclear Engineering

Raska Soemantoro, The University Of Manchester

14:30

Failure Investigation of an Aluminium Traverse Bar Using Nonlinear FEA and Field Evidence

Hamed Farahpour, Mars Engineers

14:50

Accelerating Automotive Structural Design Exploration via Deep Latent Manifold Learning

Bhavaneesh Athikary, Detroit Engineered Products (DEP)

15:10

Break

Session 4 · 15:40 – 17:20
15:40

Blast-Induced Masonry Fragmentation and Debris Projection

Tan Long Bin, A*STAR

16:00

Conversational Agentic Orchestration for CAE Workflows with Traceable Project Context

Vijay Nath Sivaraj, Code Product Solutions

16:20

Multiscale Modelling Framework for Wafer-to-Wafer Direct Bonding in Advanced Semiconductor Packaging

Nopasorn Kowathanakul, Synopsys

16:40

Overcoming Data Centre Cooling Challenges in an AI World with Physics Based Simulation and AI/ML

David Byrne, PD Simulation Pte Ltd

17:00

Industrial Digital Twins

Presenter to be confirmed

17:20

Discussion, Awards, Prizes

17:40 – 19:00

Refreshments and Post Conference Networking

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